Syuhada Ahmad, Machmud M. Nizar
This paper presents a study on the thermal conductivity of fiberboards designed to find a proper board that would be applicable for heat-conditioned building walls. Fibers produced from forestry by-products processing, such as teak (tectona grandis), meranti (shorea acuminata), bayur (pterospermum javanicum) and also from agriculture by-products such as rice husk and rice bran, were then used as the materials prepared for the filler. Results showed that thermal conductivity of the board panel with such fibers were 0.0217 W/m°C, 0.0330 W/m°C, 0.0287 W/m°C, 0.0253 W/m°C and 0.0423 W/m°C, respectively. Fiberboard panel with teak fiber as filler had the lowest thermal conductivity. It therefore could be used to significantly reduce the rate of heat transfer and it also would be applicable for such wall. © 2020 Trans Tech Publications Ltd, Switzerland.
Department of Mechanical and Industrial Engineering, Faculty of Engineering, Universitas Syiah Kuala, Jalan Tgk. Syech Abdurrauf No. 7, Darussalam, Banda Aceh, 23111, Indonesia
Research at a Glance
Register to unlock
Topics & SDG Alignment
Register to unlock
Collaboration
Register to unlock
Author Profile (Selected)
Register to unlock
References Overview
Register to unlock
Journal & Source
Register to unlock
Metadata & Integrity
Register to unlock